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Copper clad laminate
Microwave/RF Applications
Microwave/RF Applications

RA300 (Air/Ship Microwave Material)

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  • Description
    • RA300 is a PTFE composite utilizing low coefficient of
    expansion fiberglass as the supporting material and mixing
    with a specially treated nanometer ceramic, which provides
    both excellent dimensional stability and the highest degree of
    phase stability, critical in multi-layer designs. RA300 is in a
    “League of its Own” when it is combined with thin film
    resistor-conductor materials such as Ohmega-Ply ® and TCR
    ® foils utilized for embedded resistors.
    RA300 has “Best-in-Class” Insertion Loss (S21) and Loss
    Tangent (0.0011). During Development, Relong focused not
    only on reducing Loss Tangent, but also in reducing
    Conductive Losses. As a result, RA300 Insertion Loss is
    “Best-In-Class”.
    The impact of copper foil roughness on conductor loss is due
    to increase in transmission line resistance as a result of skin
    effect. Relong’s RA300 was designed to provide a quality
    peel strength without having to resort to the utilization of the
    higher loss, rougher coppers prevalent in competitive products
    to achieve acceptable copper adhesion.
    RA300 has Low CTExyz and Very Low TCEr for
    applications that require Electrical Phase Stability and
    Dielectric Constant Stability well over a -40 to 150°C
    Operating Temperature. RA300 has excellent performance
    (dimensional stability, dielectric constant stability vs.
    temperature and frequency, low absorption of moisture and
    processing chemicals, ease of process ability), and has a price
    competitive advantage.
    Compared with other materials, RA300 has a higher thermal
    conductivity, it increased heat conduction makes further
    increases in power capacity.
    Applications include Space and other Electronics who require
    a higher degree of performance such as Phase Sensitive
    Arrays for Radar, RF/Microwave Communications, Aircraft
    Collision Avoidance Systems, JTRS, etc. RA300 is also a
    preferred material for sensitive filter applications.
  • Specification
    • RA300 laminates are supplied with 1/2, 1 or 2 OZ electrodeposited copper or reverse treat copper on both sides.
    Other copper weights and rolled copper foil are available. RA300 is available bonded to a heavy metal ground
    plane. Aluminum, brass or copper plates also provide an integral heat sink and mechanical support to the
    substrate.
    When ordering for design purposes it is important to note that both thicknesses and dielectric constant of RA300
    vary with nominal thickness. The following are optimal values to use for design products please specify
    thickness, cladding, panel size and any other special considerations. Available master sheet sizes include36" x
    48", and 48" x 54". Typical panel sizes include (but, are not limited to): 12" x 18", 16"x 18" and18"x 24".
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